I used ImageJ about a year or so ago to quantify voids in x-ray images of solder joints. Luckily, I prepared a list of the Steps I used previously, but now one of those Steps seems to be out of date. I can still do all of the following Steps;
- Open x-ray image in ImageJ
- Use Square Select Tool to coral a Target Area
- Edit / Clear Outside
- Image / Type / 8-bit
But then for my next Step…
5) Process / Binary / Make Binary
… I get stuck at the last part of Step 5 - Make Binary.
I tried using Process / Binary / Threshold but I don’t seem to be getting the same result as before - easily distinguishable (void vs. not void areas).
My next Step…
6) Process / Noise / Despeckle
… seems to still be OK
But then my Final Step…
7) Analyze / Analyze Particles
… now has a few more ‘options’ and again my results are not the same.
By the way, the Analyze Particles options I was using were as follows;
Size (pixel^2) = 0-Infinity
Circularity = 0.00-1.00
Show = Outlines
And, I checked each of these boxes
Add to Manager
in situ Show
Any help would be greatly appreciated - especially if anyone know a good way (or has created an ImageJ macro) to measure and quantify voids in a solder joint x-ray image.
Here is a sample image. The ROI is the large area in the center of the image (inside the perimeter array of 20 holes) that is actually made up of 4 separate square areas. I would like to know the void levels in each of the square areas.